Center Wavelength: 1271nm, 1291nm, 1311nm and 1331nm
Connector: Dual Duplex LC/UPC
Cable Distance (Max.): 2km@SMF
Modulation: 8x106.25G PAM4
Transmitter Type: EML
Packaging Technology: COB (Chip on Board) Packaging
Chip: Broadcom 7nm DSP
Power Consumption: ≤17W
Modulation (Electrical): Modulation (Optical)
Inbuilt FEC: Protocols
Ethernet
Data Center
800G to 2x400G Breakout
400G to 1x400G Breakout
400G to 2x200G Breakout